Telephone: 01262 363088

Lead free solder, leaded solder, soldering fluxes, solder paste & cleaners

Products

Hi-Pure Solder Alloys

image1

RoHS and REACH compliant lead-free solder wire and solder bar.

Conflict free sourced raw materials in accordance with the responsible minerals initiative.   Lead Free Solder alloys SAC405, SAC305, SC100e & Sn42Bi57Ag1, Sn96Ag4,   & Lead Free 99C.

Cored Solder Wire

image2

Ultra high performance RoHS and REACH compliant soldering for robots and operators.   

Superior wetting for defect-free automated operations. High speed drag soldering for enhanced operator performance. High reliability J-STD 004B.  No offensive odours. Very low clear residues.

Lo-Void Solder Paste

image3

RoHS and REACH compliant lead-free solder paste.

Low voiding, high fill, superior wetting, J-STD 004B ROL1 and ROL0 formulations.   

Excellent print characteristics utilizing type 4 (20-38 µm) and type 5 (15-25 µm) powder.

Printer and operator friendly offering >3 days open time and tackiness time.

Supplied in all lead free SAC alloys and bismuth alloys. 12 months storage, long life 

Repair Gels and Fluxes

image4

High reliability J-STD 004B ORL0 / ROL0 halogen-free fluxes and tacky repair gels 

for improved reliability over standard no clean fluxes. Very low solids VOC free and alcohol flux for repair of lead free and lead alloys, supplied in handy push nib pens or as bulk in bottles.

Tacky fluxes supplied in easy application automatic or manual syringes, or as bulk in tubs.

Low Solids No Clean Fluxes

image5

Superior wetting and hole-fill low solids fluxes for selective and wave soldering operations.

VOC Free and alcohol formulations exhibiting excellent Lead Free heat stabilization for sustained heating requirements of dual wave soldering. High reliability J-STD 004 ORL0 / ROL0 performance spray and foaming formulations.

Stencil Clean & Care

image6

Cleaning solutions for fast effective removal of solder paste and adhesive printing residues

Formulations for:- In-Printer underside wipe,

Spray-In-Air, Ultrasonic &

Spray-Under-Immersion cleaning equipment, 

manual spray cleaning & impregnated

Stencil Wipes

Neutralisers & Circuit Cleaners

image7

Solderking offer a full range of printed circuit cleaning fluids for automated and manual cleaning operations.

Saponification cleaning fluid for spray-under-immersion and ultrasonic equipment .

Saponification concentrate for spray-in-air.    

Solvent cleaning fluids for manual cleaning and semi-aqueous batch cleaning equipment.

Insulation and Solder Masking

image8

Solderking offer a full range of Kapton® tape, dots and washers for masking sensitive components through wave or reflow operations.

Temporary solder mask offers a fast air drying, non-staining peelable layer for wave soldering operations.

Cable & Coil Fluxes

image9

Fast wetting heat stable resin fluxes for transformer dipping.  VOC Free and alcohol resin-free, no clean formulations available  for fast, clean cable tinning (when resin residues are not acceptable.

Stainless Steel Flux & Gels

image10

Strong hydrochloric acid flux for all stainless steel grades. 


Hydrochloric acid and heavy metal salt free formulations available for fast, clean soldering of decorative stainless steel parts.

Industrial & Pewter Fluxes

image11

Fluxes for dip and hand soldering copper, brass, bronze, mild steel, iron and some stainless steel grades.  

Water based, VOC Free 

Zinc chloride free formulations available with

chloride free formulations available that do not require cleaning after soldering. 

Dedicated formulation for selective solder nozzle cleaning/tinning.

Tinning Paints & Paste

image12

High activity zinc chloride flux mixed with solder powder for general pre-tinning operations. 

RoHS and REACH compliant soldering with tin/silver, pure tin & low temperature tin/bismuth solder alloys.    Available as free flowing paint and higher viscosity paste formulations , low chloride, water free versions available for extended shelf life and more precise application.  It is advised to remove zinc chloride residues after soldering.