SK C2-08 Stencil Wipes
C2-08 Stencil Wipes are effective cleaning wipes designed easy and efficient cleaning of stencils. The wipes are saturated in our unique formulation to rapidly remove solder paste, uncured inks and paste flux easily and cleanly. 100 wipes per tub.
- Apertured wipes for increased cleaning performance
- Lint Free
- Easily removes solder pastes and uncured inks from stencils
SK C1-0
A fast evaporating isopropanol based stencil cleaner suited for manually removing solder paste from stencils and misprinted PCB’s.
- Stencil cleaner for effective removal of solder paste, uncured inks and paste flux at room temperature.
- Fast evaporation rate
- Environmentally friendly, with low odour and no ozone depleting substances.
SK C2-08
A slow evaporating hydrocarbon solvent based stencil cleaner. SK C2-08 leaves a microfilm on the stencil after wiping which helps protect the stencil and assists with printing process. SK C2-08 is suitable as an in-printer underside wipe solvent and for manually removing solder paste.
- Stencil cleaner for effective removal of solder paste, uncured inks and paste flux at room temperature.
- Effective for stencil under wiping in printers
- Can be used as spray in air, spray pressure or ultrasonic as a mechanical separator.
- Flashpoint >61ºC allowing it to be classified as non flammable.
- Moderate evaporation rate
- Environmentally friendly, with low odour and no ozone depleting substances
SK C3-19
A fast evaporating blend of alcohol and glycol ether based stencil cleaner, offering very efficient removal of both solder paste and un-cured adhesive.
- Stencil cleaner for effective removal of solder paste, uncured inks and paste flux at room temperature.
- Fast evaporation rate
- Environmentally friendly, with low odour and no ozone depleting substances.
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